5-4 Activities
5-4-1 Symposium
Symposia on the topics in the forefront of electronic equipping technology have been held every year since 1999.
| (1) 1999 July 27 (Tue.) The Industry Club of Japan |
| “Process Engineering in the Built-up Multi-Layer Wiring Board” |
| (2) 2000 May 22 (Mon.) Tokyo Institute of Technology |
| “Microscopic Connection Technology – Process Engineering in Micro-Packaging” |
| (3) 2000 August 25 (Fri.) Sumitomo Bakelite Co., Ltd. |
| “The Latest Manufacturing Technology of Minute Electronic Circuit” |
| (4) 2001 May 18 (Fri.) Sumitomo Bakelite Co., Ltd. |
| “The Latest Technology of Connection between Electronic Components” |
| (5) 2002 May 18 (Tue.) Sumitomo Bakelite Co., Ltd. |
| “The Latest Technology of Manufacturing Substrate with Built-in Electronic Parts” |
| (6) 2003 August 6 (Wed.) Tokyo Institute of Technology |
| “MEMS and High Density Equipping Technology” |
| (7) 2004 May 26 (Wed.) Tokyo Institute of Technology |
| “Development of Flexible Material” |
| (8) 2005 July 25 (Wed.) Tokyo Institute of Technology |
| “Electronic Equipments in Automobile” |
| (9) 2006 August 7 (Mon.) Tokyo Institute of Technology |
| “The Latest Technology of High Density LSI and Packaging (From 2- to 3-Dimensional) “ |
| (10) 2007 July 20 (Fri.) Tokyo Institute of Technology |
| “Strategy of Kingdom of Electronic Material, Japan” |
| (11) 2008 August 19 (Tue.) Tokyo Institute of Technology |
| “Heat Discharge from Electronic Circuit and Device” |
5-4-2 Lecture presentation
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"Next generation technology on silver wiring" Hirokazu Ezawa, Toshiba Semiconductor Company |
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| Date： | 2002 December 12 (Thu.) |
| Venue： | Sumitomo Bakelite Co., Ltd. |
5-4-3 Network Event of Technology
| Date： | 2004 November 29 (Mon.) |
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| Venue： | Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT) |
5-4-4 Symposium at Autumn Annual Meeting of SCEJ
Symposia on electronics are held at the autumn annual meeting of SCEJ every year since 1999. The most up-to date results of research works on electronics are presented in the Symposia.
5-4-5 Joint Activities with other Divisions
Symposia on electronics are held at the autumn annual meeting of SCEJ every year since 1999. The most up-to date results of research works on electronics are presented in the Symposia.
| (1) 2005 September 14 (Thu.) Okayama |
| Joint Seminar with Particle-Fluid Process Division |
| (2) 2007 September13 (Thu.) and 14(Fri.) Hokkaido University |
| Joint Symposium with Environment Division, “Recycling Technology of Metal used in Electronic Equipments” |
5-4-6 Cooperation with other Organization
Electronics Division is a member of the Electronics System Integration Council, a united organization of Scientific Societies and Research Institutes, since 2004.
5-4-7 International Activities
| (1) 2002 November 7 (Thu.) Tokyo Institute of Technology |
| “Damascene Copper Process and New Material for Next Generation Mobile Phone” Hariklia Deligianni (IBM) |
| (2) 2003 December 4 (Thu.) Sumitomo Bakelite Co., Ltd. |
| “Recent Advances on Wafer Level Packaging and System in Package” C. P. Wong (Georgia Institute of Technology) |
| (3) 2005 October 20 (Thu.) Tokyo Institute of Technology |
| “The Status of the European Flat Panel Display Industry: Research and Development Activities, Applications, and Markets” Joerg Winkler (VDMA-The German Engineering Federation) |
| “Heterogeneous Integration: The Bridge between Micro/Nanoelectronics and Application” Rolf Aschenbrenner (Fraunhofer IZM) |
5-4-8 Entrusted Research Project
2001-2006:
A research project of “Development of Fundamental Technology of High Density Equipment for Next Generation Information and Communication System” was entrusted to 5 companies who are the supporting members of our Division.
5-4-9 Other Activities
2004 October ～ 2005 February Yokohama National University
Short Course “Education Class on Functional Material of Higher Performance”